T2 Series Cutter: Diamond tableis joined by a carbide substrate with an interface of sinusoidal wave straight groove, which effectively increases the contact area between diamond table and substrate, and enhances the bonding strength of the interface. Usi
| 1613-T2 | |
| Diameter： | 16.00±0.02mm |
| Hight： |
13.20±0.05mm |
| Table Size： |
2.0±0.2mm |
| Impacts： |
50 J x10times |
| VTL (Pass): |
30pass |
| Heating Test:： |
750°C 10min |
| 1609-T2-C35 | |
| Diameter： |
16.00±0.02mm |
| Hight： |
9.00±0.05mm |
| Table Size： |
2.0±0.2mm |
| Impacts： |
50 J x10times |
| VTL (Pass): |
30pass |
| Heating Test: |
750°C 10min |
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